WaferNet utilizes unique industry alliances to provide silicon wafers in a wide range of diameters, grades, and specifications. Our extensive, on-site inventory allows us to quickly respond to large volume and complex requirements. Match your service needs with WaferNet's inventory by searching our summary of specifications or by filling out a product request form.

Need a custom service that is not listed? Connect with us via phone, fax or email to discuss your requirements in more detail.

DIELECTRIC FILM	THICKNESS RANGE	SPECIFICATION
Thermal Oxide	30 angstroms - 24,000 angstroms	+/- 5% WIWNU*
BPSG	10,000 angstroms - 20,000 angstroms Specify Boron and Phosphorus concentration	<=3% WIWNU 3mm edge exclusion Anneal available
PECVD TEOS	1,700 angstroms - 30,000 angstroms	<=2% WIWNU 3mm edge exclusion
PECVD HDP	4,500 angstroms - 8,000 angstroms	<=3% WIWNU 3mm edge exclusion
PECVD SiN	1,000 angstroms - 5,000 angstroms	<3% WIWNU 3mm edge exclusion

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METAL FILM	THICKNESS RANGE	SPECIFICATION
Barrier Films(Ta/TaN/Ti/TiN)	100 angstroms - 2,000 angstroms	Several CVD and PVD deposition tools available 3%-5% WIWNU*
Tungsten	4,500 angstroms - 9,000 angstroms	Both CVD and PVD deposition tools available <3% WIWNU
PVD Copper	Up to 15,000 angstroms	<=5% WIWNU
Electroplated Copper	10,000 angstroms - 15, 000 angstroms	<=4% WIWNU 3mm edge exclusion

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Please contact WaferNet for custom silicon wafer services.