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WaferNet utilizes unique industry alliances to provide silicon wafers in a wide range of diameters, grades, and specifications. Our extensive, on-site inventory allows us to quickly respond to large volume and complex requirements. Match your service needs with WaferNet's inventory by searching our summary of specifications or by filling out a service request form.
Need a custom service that is not listed? Connect with us via phone, fax or email to discuss your requirements in more detail.
| DIELECTRIC FILM |
THICKNESS RANGE |
SPECIFICATION |
| Thermal Oxide |
30 angstroms - 24,000 angstroms |
+/- 5% WIWNU* |
| BPSG |
10,000 angstroms - 20,000 angstroms
Specify Boron and Phosphorus concentration |
<=3% WIWNU
3mm edge exclusion Anneal available |
| PECVD TEOS |
1,700 angstroms - 30,000 angstroms |
<=2% WIWNU
3mm edge exclusion |
| PECVD HDP |
4,500 angstroms - 8,000 angstroms |
<=3% WIWNU
3mm edge exclusion |
| PECVD SiN |
1,000 angstroms - 5,000 angstroms |
<3% WIWNU
3mm edge exclusion |
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METAL FILM |
THICKNESS RANGE |
SPECIFICATION |
| Barrier Films(Ta/TaN/Ti/TiN) |
100 angstroms - 2,000 angstroms |
Several CVD and PVD deposition tools available
3%-5% WIWNU*
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| Tungsten |
4,500 angstroms - 9,000 angstroms |
Both CVD and PVD deposition tools available
<3% WIWNU
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| PVD Copper |
Up to 15,000 angstroms |
<=5% WIWNU |
| Electroplated Copper |
10,000 angstroms - 15, 000 angstroms |
<=4% WIWNU
3mm edge exclusion |
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Please contact WaferNet for custom silicon wafer services.
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